Datasheet

LTC4449
12
4449fa
PACKAGE DESCRIPTION
3.00 p0.10
(2 SIDES)
2.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 REF
1
4
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DCB8) DFN 0106 REV A
0.23 p 0.05
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR 0.25
s 45o CHAMFER
1.35 p0.10
1.65 p 0.10
0.25 p 0.05
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.10 p0.05
0.70 p0.05
3.50 p0.05
PACKAGE
OUTLINE
0.45 BSC
1.35 p0.05
1.65 p 0.05
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)