Datasheet

LTC4442/LTC4442-1
11
4442fb
To obtain the optimum performance from the LTC4442:
A. Mount the bypass capacitors as close as possible
between the V
LOGIC
and GND pins, the V
CC
and GND
pins, and the BOOST and TS pins. The leads should
be shortened as much as possible to reduce lead
inductance.
B. Use a low inductance, low impedance ground plane
to reduce any ground drop and stray capacitance.
Remember that the LTC4442 switches greater than
5A peak currents and any signifi cant ground drop will
degrade signal integrity.
APPLICATIONS INFORMATION
C. Plan the power/ground routing carefully. Know where
the large load switching current is coming from and
going to. Maintain separate ground return paths for
the input pin and the output power stage.
D. Keep the copper traces between the driver output pins
and the load short and wide.
E. Be sure to solder the Exposed Pad on the back side of
the LTC4442 packages to the board. Correctly soldered
to a 2500mm
2
double-sided 1oz copper board, the
LTC4442 has a thermal resistance of approximately
40°C/W. Failure to make good thermal contact between
the exposed back side and the copper board will result
in thermal resistances far greater.