Datasheet

LTC4425
19
4425f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MSOP (MSE12) 0608 REV B
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 –0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12
12 11 10 9 8 7
7
DETAIL “B”
1
6
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
RECOMMENDED SOLDER PAD LAYOUT
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ± 0.102
(.112 ± .004)
2.845 ± 0.102
(.112 ± .004)
4.039 ± 0.102
(.159 ± .004)
(NOTE 3)
1.651 ± 0.102
(.065 ± .004)
0.1016 ± 0.0508
(.004 ± .002)
123456
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.406 ± 0.076
(.016 ± .003)
REF
4.90 ± 0.152
(.193 ± .006)
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
PACKAGE DESCRIPTION