Datasheet

LTC4413
12
4413fc
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
[phone]
●
FAX: [phone]
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www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2004
LT 0909 REV C • PRINTED IN USA
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PACKAGE DESCRIPTION
PART NUMBER DESCRIPTION COMMENTS
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DFN Package
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Simplifi ed Load Sharing, 3V ≤ V
IN
≤ 28V (3V ≤ V
IN
≤ 36V for HV)
LTC4413-1/LTC4413-2 Dual 2.6A, 2.5V to 5.5V Fast Ideal Diodes in
3mm × 3mm DFN
Fast Pin Compatible Replacement for the LTC4413 (LTC4413-2 with
Overvoltage Protection)
ThinSOT is a trademark of Linear Technology Corporation.
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
3.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 p 0.10
(2 SIDES)
0.75 p0.05
R = 0.125
TYP
2.38 p0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV B 0309
0.25 p 0.05
2.38 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 p0.05
(2 SIDES)2.15 p0.05
0.50
BSC
0.70 p0.05
3.55 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC