Datasheet

LTC4361-1/LTC4361-2
13
436112fb
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
0.64 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.37 ±0.10
(2 SIDES)
1
4
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC8) DFN 0409 REVA
0.23 ±0.05
0.45 BSC
0.25 ±0.05
1.37 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
DC8 Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev A)
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.