Datasheet

LTC4266
27
4266fe
For more information www.linear.com/LTC4266
ApplicAtions inForMAtion
Figure 21. Good PCB Layout Example
4266 F21
PORT A R
SENSE
PORT B R
SENSE
FOUR LARGE VIAS
TO V
EE
PLANE
PIN 1
U1 THE PADDLE IS
CONNECTED TO
V
EE
PINS
KELVIN SENSE TRACE CONNECTS U1
TO V
EE
THROUGH THE VIAS ON THE RIGHT
EDGE OF V
EE
PLANE (ON SOME INNER LAYER)
VIAS TO SOURCE PIN OF
THE PORT D MOSFET
LOCATED ON THE OPPOSITE
SIDE OF THE BOARD
HOLE IN V
EE
PLANE
PORT C R
SENSE
PORT D R
SENSE
pAckAge Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
GW Package
36-Lead Plastic SSOP (Wide .300 Inch)
(Reference LTC DWG # 05-08-1642)
GW36 SSOP 0204
0° – 8° TYP
0.355
REF
0.231 – 0.3175
(.0091 – .0125)
0.40 – 1.27
(.015 – .050)
7.417 – 7.595**
(.292 – .299)
× 45°
0.254 – 0.406
(.010 – .016)
2.286 – 2.388
(.090 – .094)
0.1 – 0.3
(.004 – .0118)
2.44 – 2.64
(.096 – .104)
0.800
(.0315)
BSC
0.28 – 0.51
(.011 – .02)
TYP
15.291 – 15.545*
(.602 – .612)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
10.11 – 10.55
(.398 – .415)
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
10.804 MIN
RECOMMENDED SOLDER PAD LAYOUT
7.75 – 8.258
1936
181
0.800 BSC0.520 ±0.0635
1.40 ±0.127
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.152mm (0.006") PER SIDE
*
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
**
MILLIMETERS
(INCHES)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
GW Package
36-Lead Plastic SSOP (Wide .300 Inch)
(Reference LTC DWG # 05-08-1642)