Datasheet
LTC4155
8
4155fc
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at T
A
≈
T
J
= 25°C (Note 2). V
BUS
= 5V, BATSNS = 3.7V, DVCC = 3.3V,
R
CLPROG1
= R
CLPROG2
= 1.21k, R
PROG
= 499Ω, unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
I
IL
,
SDA,SCL
Input Leakage Low SDA, SCL = 0V –1 1 µA
V
OL
Digital Output Low (SDA) I
SDA
= 3mA 0.4 V
f
SCL
Clock Operating Frequency 400 kHz
t
BUF
Bus Free Time Between STOP and
START Condition
1.3 µs
t
HD_SDA
Hold Time After (Repeated) START
Condition
0.6 µs
t
SU_SDA
Repeated START Condition Set-Up
Time
0.6 µs
t
SU_STO
STOP Condition Time 0.6 µs
t
HD_DAT(OUT)
Data Hold Time 0 900 ns
t
HD_DAT(IN)
Input Data Hold Time 0 ns
t
SU_DAT
Data Set-Up Time 100 ns
t
LOW
Clock LOW Period 1.3 µs
t
HIGH
Clock HIGH Period 0.6 µs
t
f
Clock Data Fall Time 20 300 ns
t
r
Clock Data Rise Time 20 300 ns
t
SP
Spike Suppression Time 50 ns
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC4155E is tested under pulsed load conditions such that
T
J
≈
T
A
. The LTC4155E is guaranteed to meet performance specifications
from 0°C to 85°C junction temperature. Specifications over the
–40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LTC4155I is guaranteed over the full –40°C to 125°C operating
junction temperature range. The junction temperature (T
J
, in °C) is
calculated from the ambient temperature (T
A
, in °C) and power dissipation
(P
D
, in watts) according to the formula:
T
J
= T
A
+ (P
D
• θ
JA
), where the package thermal impedance
θ
JA
= 43°C/W)
Note that the maximum ambient temperature consistent with these
specifications is determined by specific operating conditions in
conjunction with board layout, the rated package thermal resistance and
other environmental factors.
Note 3. V
MAX
is the maximum of V
BUS
or BATSNS
Note 4. Total input current is I
VBUSQ
+ V
CLPROG
/R
CLPROG
• (h
CLPROG
+ 1).