Datasheet

LTC4151
14
4151fd
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
Typical applicaTion
LTC4151
SCL
V
IN
48V
V
IN
SENSE
+
SENSE
–
0.2Ω
I
2
C
SDA
ADR1
ADR0
ADIN
40.2k
1%
100k AT 25°C
1%
1.5k
1%
VISHAY
2381 615 4.104
250mA
LOAD
GND
4151 TA02
Temperature Monitoring with an NTC Thermistor While
Measuring Load Current and LTC4151 Supply Current
T(°C) = 58.82 • (N
ADIN
/N
VIN
– 0.1066), 20°C < T < 60°C.
N
ADIN
AND N
VIN
ARE DIGITAL CODES MEASURED BY THE
ADC AT THE ADIN AND V
IN
PINS, RESPECTIVELY.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.