Datasheet

LTC4053-4.2
14
4053fa
PROG pin. With no additional capacitance on the PROG
pin, stability is acceptable with program resistor values as
high as 50k. However, additional capacitance on this node
reduces the maximum allowed program resistor. The pole
frequency at the PROG pin should be kept above 500kHz.
Therefore, if the PROG pin is loaded with a capacitance, C,
the following equation should be used to calculate the
maximum resistance value for R
PROG
:
R
PROG
< 1/(6.283 • 5 × 10
5
• C)
5
7
R
PROG
C
FILTER
CHARGE
CURRENT
MONITOR
CIRCUITRY
10k
LTC4053
4053 F05
GND
PROG
Figure 5. Isolating Capacitive Load on PROG Pin and Filtering
APPLICATIO S I FOR ATIO
WUUU
Average, rather than instantaneous, battery current may
be of interest to the user. For example, if a switching power
supply operating in low-current mode is connected in
parallel with the battery the average current being pulled
out of the BAT pin is typically of more interest than the
instantaneous current pulses. In such a case, a simple RC
filter can be used on the PROG pin to measure the average
battery current as shown in Figure 5. A 10k resistor is
added between the PROG pin and the filter capacitor and
monitoring circuit to ensure stability.
PACKAGE DESCRIPTIO
U
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD10) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE