Datasheet

LTC3876
47
3876f
4.75
(.187)
REF
FE38 (AA) TSSOP REV C 0910
0.09 – 0.20
(.0035 – .0079)
0s – 8s
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1
19
20
REF
9.60 – 9.80*
(.378 – .386)
38
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.50
(.0196)
BSC
0.17 – 0.27
(.0067 – .0106)
TYP
RECOMMENDED SOLDER PAD LAYOUT
0.315 ±0.05
0.50 BSC
4.50 REF
6.60 ±0.10
1.05 ±0.10
4.75 REF
2.74 REF
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
38-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1772 Rev C)
Exposed Pad Variation AA
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.