Datasheet

LTC3872
15
3872fc
For more information www.linear.com/LTC3872
And so the inductor value is:
L =
V
IN(MIN)
∆I
L
• f
•D
MAX
=
3.3V
1.3A •550kHz
•0.39 =1.8µH
The component chosen is a 2.2µH inductor made by
Sumida (part number CEP125-H 1ROMH).
3. Assuming a MOSFET junction temperature of 125°C,
the room temperature MOSFET R
DS(ON)
should be less
than:
R
DS(ON)
≤ V
ENSS E(M AX)
•
1–D
MAX
1+
χ
2




•I
O(MAX)
•ρ
T
= 0.175V •
1–0.39
1+
0.4
2




•2A •1.5
≈ 30mΩ
The MOSFET used was the Si3460, which has a maximum
R
DS(ON)
of 27mΩ at 4.5V V
GS
, a BV
DSS
of greater than
30V, and a gate charge of 13.5nC at 4.5V V
GS
.
4. The diode for this design must handle a maximum DC
output current of 2A and be rated for a minimum reverse
voltage of V
OUT
, or 5V. A 25A, 15V diode from On Semi-
conductor (MBRB2515L) was chosen for its high power
dissipation capability.
5.
The output capacitor usually consists of a lower valued,
low ESR ceramic.
6. The choice of an input capacitor for a boost converter
depends on the impedance of the source supply and the
amount of input ripple the converter will safely tolerate.
For this particular design two 22µF Taiyo Yuden ceramic
capacitors (JMK325BJ226MM) are required (the input
and return lead lengths are kept to a few inches). As
with the output node, check the input ripple with a single
oscilloscope probe connected across the input capacitor
terminals.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3872. These items are illustrated graphically in
the layout diagram in Figure 8. Check the following in
your layout:
1. The Schottky diode should be closely connected between
the output capacitor and the drain of the external MOSFET.
2. The input decoupling capacitor (0.1µF) should be con
-
nected closely between V
IN
and GND.
3. The trace from SW to the switch point should be kept
short.
4. Keep the switching node NGATE away from sensitive
small signal nodes.
5. The V
FB
pin should connect directly to the feedback
resistors. The resistive divider R1 and R2 must be con-
nected between the (+) plate of C
OUT
and signal ground.
Figure 8. LTC3872 Layout Diagram (See PC Board Layout Checklist)
IPRG
I
TH
V
FB
GND
SW
RUN/SS
V
IN
NGATE
LTC3872
3872 F08
R1
R2
R
ITH
C
IN
C
OUT
V
OUT
V
IN
C
ITH
+ +
D1
M1L1
BOLD LINES INDICATE HIGH CURRENT PATHS
applicaTions inForMaTion