Datasheet

LTC3868-1
19
38681fd
APPLICATIONS INFORMATION
Selection criteria for the power MOSFETs include the
on-resistance, R
DS(ON)
, Miller capacitance, C
MILLER
, input
voltage and maximum output current. Miller capacitance,
C
MILLER
, can be approximated from the gate charge curve
usually provided on the MOSFET manufacturers’ data
sheet. C
MILLER
is equal to the increase in gate charge
along the horizontal axis while the curve is approximately
fl at divided by the specifi ed change in V
DS
. This result is
then multiplied by the ratio of the application applied V
DS
to the gate charge curve specifi ed V
DS
. When the IC is
operating in continuous mode the duty cycles for the top
and bottom MOSFETs are given by:
Main Switch Duty Cycle =
V
OUT
V
IN
Synchronous Switch Duty Cycle =
V
IN
− V
OUT
V
IN
The MOSFET power dissipations at maximum output
current are given by:
P
MAIN
=
V
OUT
V
IN
I
MAX
()
2
1+δ
()
R
DS(ON)
+
V
IN
()
2
I
MAX
2
⎛
⎝
⎜
⎞
⎠
⎟
R
DR
()
C
MILLER
()
•
1
V
INTVCC
–V
THMIN
+
1
V
THMIN
⎡
⎣
⎢
⎤
⎦
⎥
f
()
P
SYNC
=
V
IN
–V
OUT
V
IN
I
MAX
()
2
1+δ
()
R
DS(ON)
where δ is the temperature dependency of R
DS(ON)
and
R
DR
(approximately 2) is the effective driver resistance
at the MOSFET’s Miller threshold voltage. V
THMIN
is the
typical MOSFET minimum threshold voltage.
Both MOSFETs have I
2
R losses while the topside N-channel
equation includes an additional term for transition losses,
which are highest at high input voltages. For V
IN
< 20V
the high current effi ciency generally improves with larger
MOSFETs, while for V
IN
> 20V the transition losses rapidly
increase to the point that the use of a higher R
DS(ON)
device
with lower C
MILLER
actually provides higher effi ciency. The
synchronous MOSFET losses are greatest at high input
voltage when the top switch duty factor is low or during
a short-circuit when the synchronous switch is on close
to 100% of the period.
The term (1+ δ) is generally given for a MOSFET in the
form of a normalized R
DS(ON)
vs Temperature curve, but
δ = 0.005/°C can be used as an approximation for low
voltage MOSFETs.
The optional Schottky diodes D1 and D2 shown in Figure 10
conduct during the dead-time between the conduction of
the two power MOSFETs. This prevents the body diode of
the bottom MOSFET from turning on, storing charge during
the dead-time and requiring a reverse recovery period that
could cost as much as 3% in effi ciency at high V
IN
. A 1A
to 3A Schottky is generally a good compromise for both
regions of operation due to the relatively small average
current. Larger diodes result in additional transition losses
due to their larger junction capacitance.
C
IN
and C
OUT
Selection
The selection of C
IN
is simplifi ed by the 2-phase architec-
ture and its impact on the worst-case RMS current drawn
through the input network (battery/fuse/capacitor). It can be
shown that the worst-case capacitor RMS current occurs
when only one controller is operating. The controller with
the highest (V
OUT
)(I
OUT
) product needs to be used in the
formula shown in Equation 1 to determine the maximum
RMS capacitor current requirement. Increasing the out-
put current drawn from the other controller will actually
decrease the input RMS ripple current from its maximum
value. The out-of-phase technique typically reduces the
input capacitor’s RMS ripple current by a factor of 30%
to 70% when compared to a single phase power supply
solution.
In continuous mode, the source current of the top MOSFET
is a square wave of duty cycle (V
OUT
)/(V
IN
). To prevent
large voltage transients, a low ESR capacitor sized for the
maximum RMS current of one channel must be used. The
maximum RMS capacitor current is given by:
C
IN
Required I
RMS
≈
I
MAX
V
IN
V
OUT
()
V
IN
–V
OUT
()
⎡
⎣
⎤
⎦
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