Datasheet
LTC3862
40
3862fc
For more information www.linear.com/LTC3862
UH Package
24-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1747 Rev A)
5.00 ± 0.10
5.00 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.55 ± 0.10
23
1
2
24
BOTTOM VIEW—EXPOSED PAD
3.25 REF
3.20 ± 0.10
3.20 ± 0.10
0.75 ± 0.05
R = 0.150
TYP
0.30 ± 0.05
(UH24) QFN 0708 REV A
0.65 BSC
0.200 REF
0.00 – 0.05
0.75 ±0.05
3.25 REF
3.90 ±0.05
5.40 ±0.05
0.30 ± 0.05
PACKAGE OUTLINE
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
R = 0.05
TYP
3.20 ± 0.05
3.20 ± 0.05
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.