Datasheet

LTC3835
28
3835fd
UFD Package
20-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
4.00 ± 0.10
(2 SIDES)
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ± 0.05
0.200 REF
0.00 – 0.05
1.50 REF
0.40 ± 0.10
19 20
1
2
BOTTOM VIEW—EXPOSED PAD
2.50 REF
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
0.25 ± 0.05
0.50 BSC
(UFD20) QFN 0506 REV B
R = 0.05 TYP
2.65 ± 0.10
3.65 ± 0.10
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
2.65 ± 0.05
2.50 REF
4.10 ± 0.05
5.50 ± 0.05
1.50 REF
3.10 ± 0.05
4.50 ± 0.05
PACKAGE
OUTLINE
3.65 ± 0.05
0.50 BSC
PACKAGE DESCRIPTION