Datasheet

LTC3833
35
3833f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev H)
Exposed Pad Variation CB
FE20 (CB) TSSOP REV H 0910
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8 9 10
111214 13
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
2.74
(.108)
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
3.86
(.152)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC