Datasheet

LTC3824
12
3824fg
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev G)
MSOP (MSE) 0910 REV G
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2
3
4 5
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
10
1
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
1.68 ± 0.102
(.066 ± .004)
1.88 ± 0.102
(.074 ± .004)
0.50
(.0197)
BSC
0.305 ± 0.038
(.0120 ± .0015)
TYP
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.68
(.066)
1.88
(.074)
0.1016 ± 0.0508
(.004 ± .002)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
Typical applicaTion
12V 2A Buck Converter
package DescripTion
3824 TA02
15k
8.06k
113k
1000pF
68k
C
OUT
270µF
1µF
16V
X7R
L1
33µH
V
OUT
12V
2A
0.1µF
301k
C
IN1
33µF
100V
C
IN2
2.2µF
100V
1000pF
LTC3824
SENSESYNC/MODE
GATE
V
FB
V
C
V
CC
R
SET
GND
SS
V
IN
12.5V TO 60V
D1
C
IN1
: SANYO 63MV68AX
C
IN2
: TDK C4532X7R2A225M
C
OUT
: SANYO OSCON, 16SP270M, TDKC2012X7RIC105K
L1: D104C919AS-330M
D1: SS3H9
Q1: Si7465DP
Q1
+
+
R
S
0.025Ω
100pF
C
CAP
0.1µF
CAP