Datasheet

LTC3809-1
22
38091fc
PACKAGE DESCRIPTION
TYPICAL APPLICATIONS
10μF
MP
Si7540DP
MN
Si7540DP
1
6
4
2
3
8
9
10
7
5
11
L
1.5μH
15k
1.18k
118k
100pF
59k
590Ω
220pF
IPRG
TRACK/SS
TG
SW
BG
Vx
RUN
+
MODE
I
TH
V
FB
GND
V
IN
LTC3809EDD-1
38091 TA03
V
IN
2.75V TO 8V
V
OUT
1.8V
(5A AT 5V
IN
)
L: VISHAY IHLP-2525CZ-01
C
OUT
: SANYO 4TPB150MC
V
OUT
< Vx
C
OUT
150μF
Synchronous DC/DC Converter with Output Tracking
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION
OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS
OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.38 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 p 0.10
(2 SIDES)
0.75 p0.05
R = 0.115
TYP
2.38 p0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD10) DFN 1103
0.25 p 0.05
2.38 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 p0.05
(2 SIDES)
2.15 p0.05
0.50
BSC
0.675 p0.05
3.50 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON
ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE