Datasheet

LTC3677-3
43
36773f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
UFF Package
Variation: UFFMA
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev Ø)
4.00 p0.10
5.60 REF
6.10 ±0.05
2.56 ±0.05
2.64 ±0.05
1.70 ±0.05
7.50 ±0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
43
1
2
44
BOTTOM VIEW—EXPOSED PAD
2.40 REF
3.10 ±0.05
4.50 ±0.05
7.00 p0.10 5.60 REF
0.75 p0.05
0.20 p0.05
(UFF44MA) QFN REF Ø 1107
0.40 BSC
0.98 ±0.10
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.40 REF
2.64
±0.10
0.40 p0.10
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
UFFMA Package
44-Lead Plastic QFN (4mm s 7mm)
(Reference LTC DWG # 05-08-1762 Rev Ø)
2.56
±0.10
1.70
±0.10
2.76
±0.10
0.74 ±0.10
R = 0.10 TYP
R = 0.10 TYP
R = 0.10
TYP
0.74 ±0.10
0.40 BSC
PACKAGE
OUTLINE
0.20 ±0.05
2.02 ±0.05
2.76 ±0.05
0.98 ±0.05
1.48 ±0.05
0.70 ±0.05