Datasheet

LTC3675/LTC3675-1
36
36751fc
For more information www.linear.com/LTC3675
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
4.00 ±0.10
5.60 REF
6.10 ±0.05
2.56 ±0.05
2.64 ±0.05
1.70 ±0.05
7.50 ±0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
43
1
2
44
BOTTOM VIEW—EXPOSED PAD
2.40 REF
3.10 ±0.05
4.50 ±0.05
7.00 ±0.10 5.60 REF
0.75 ±0.05
0.20 ±0.05
(UFF44MA) QFN REV A 0410
0.40 BSC
0.98 ±0.10
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.40 REF
2.64
±0.10
0.40 ±0.10
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
UFF Package
Variation: UFF44MA
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev A)
2.56
±0.10
1.70
±0.10
2.76
±0.10
0.74 ±0.10
R = 0.10 TYP
R = 0.10 TYP
R = 0.10
TYP
0.74 ±0.10
0.40 BSC
PACKAGE
OUTLINE
0.20 ±0.05
2.02 ±0.05
2.76 ±0.05
0.98 ±0.05
1.48 ±0.05
0.70 ±0.05