Datasheet

LTC3625/LTC3625-1
15
3625f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
4.00 p0.10
(2 SIDES)
3.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 p 0.10
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
16
127
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45o
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
3.30 p0.10
0.25 p 0.05
0.50 BSC
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 p0.05
0.70 p0.05
3.60 p0.05
PACKAGE
OUTLINE
1.70 p 0.05
3.30 p0.05
0.50 BSC
0.25 p 0.05
Typical applicaTions
•
V
OUT
SW1
SW2
CTL
EN
GND
V
SEL
V
MID
LTC3625
PROG
L2 3.3µH
C1
100F
*
M1
IRF7424
UV
DETECTOR
*EXPOSED PAD TO
BE CONNECTED TO A
THERMAL PAD ISOLATED
FROM THE SYSTEM GROUND
FDS3672
V
IN
DC-A
64
LT1737 FLYBACK
2
GND
12V
•
10
L1 3.3µH
L4 3.3µH
L3 3.3µH
L6 3.3µH
L5 3.3µH
C2
100F
R1
143k
V
OUT
CTL
EN
GND
V
SEL
LTC3625
PROG
C3
100F
V
IN
C4
100F
R2
143k
V
OUT
CTL
EN
GND
V
SEL
LTC3625
PROG
C5
100F
V
IN
C6
100F
R3
143k
FDS3672
LTC4355
IDEAL DIODE
DC/DC
LTM4601A
V
IN
V
OUT
GND GND
1.8V
GND
DC-B
7
•
11
DC-C
8
•
12
LT1737
*
SW1
SW2
V
MID
SW1
SW2
V
MID
12V Power Ride-Through