Datasheet
LTC3610
17
3610ff
Figure 6. Design Example: 5V to 24V Input to 2.5V/12A at 550kHz
V
OUT
2.5V AT
12A
GND
GND
V
IN
V
IN
5V TO 24V
C
OUT1
220µF
2×
C5
22µF
6.3V
L1
0.8µH
C
IN
10µF
35V
3×
+
C6
10µF
35V
+
(OPTIONAL)
(OPTIONAL)
C
IN
: TAIYO YUDEN GMK325BJ106MM-B
C
OUT
: SANYO 10TPE220ML
L1: CDEP85NP-R80MC-50
C5: MURATA GRM31CR60J226KE19
LTC3610
SGND
48
SGND
47
SGND
46
SGND
45
EXTV
CC
EXTV
CC
44
V
FB
43
SGND
42
I
ON
41
SGND
40
FCB
39
I
TH
38
V
RNG
37
PGOOD
36
V
ON
35
SGND
34
SGND
GND
V
OUT
V
OUT
33
PV
IN
17
PV
IN
18
PV
IN
19
PV
IN
20
PV
IN
21
PV
IN
22
PV
IN
23
PV
IN
24
PV
IN
25
SW
SW
SW
SW
26
NC
27
SGND
28
BOOST
29
RUN/SS
30
SGND
31
SGND
32
PGND
64
PGND
63
PGND
62
PGND
61
PGND
60
PGND
59
PGND
58
PGND
57
PGND
56
SW
55
INTV
CC
INTV
CC
INTV
CC
54
INTV
CC
INTV
CC
53
SV
IN
V
IN
52
SV
IN
51
SGND
50
SGND
49
PGND
1
PGND
2
PGND
3
SW
4
SW
5
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
PV
IN
V
IN
12
PV
IN
13
PV
IN
14
PV
IN
15
PV
IN
16
3610 F06
C
F
0.1µF
25V
R
F1
1Ω
C
VCC
4.7µF
6.3V
C3
C
ON
0.01µF
C4
0.01µF
C2C1
C
B1
0.22µF
D
B
CMDSH-3
C
SS
0.1µF
V
IN
R
SS1
510k
(OPTIONAL)
(OPTIONAL)
(OPTIONAL)
(OPTIONAL)
R1
9.5k
1%
R2
30.1k
1%
R
VON
0Ω
R
PG1
100k
R
ON
182k
1%
R5
31.84k
R3
0Ω
C
C1
470pF
C
C2
100pF
(OPTIONAL)
applications inForMation
PC Board Layout Checklist
When laying out a PC board follow one of the two sug-
gested approaches. The simple PC board layout requires
a dedicated ground plane layer. Also, for higher currents, a
multilayer board is recommended to help with heat sinking
of power components.
•
The
ground plane layer should not have any traces and
it should be as close as possible to the layer with the
LTC3610.
• Place C
IN
and C
OUT
all in one compact area, close to
the LTC3610. It may help to have some components
on the bottom side of the board.
•
Keep small-signal components close to the L
TC3610.
•
Ground connections (including LTC3610 SGND and
PGND) should be made through immediate vias to
the ground plane. Use several larger vias for power
components.
• Use a compact plane for the switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
• Use
planes for V
IN
and V
OUT
to maintain good voltage
filtering and to keep power losses low.
• Flood
all unused areas on all layers with copper. Flood-
ing with copper reduces the temperature rise of power
components. Connect these copper areas to any DC
net (V
IN
, V
OUT
, GND or to any other DC rail in your
system).