Datasheet

LTC3577/LTC3577-1
52
3577fa
4.00 p0.10
5.60 REF
6.10 ±0.05
2.56 ±0.05
2.64 ±0.05
1.70 ±0.05
7.50 ±0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
43
1
2
44
BOTTOM VIEW—EXPOSED PAD
2.40 REF
3.10 ±0.05
4.50 ±0.05
7.00 p0.10 5.60 REF
0.75 p0.05
0.20 p0.05
(UFF44MA) QFN REF Ø 1107
0.40 BSC
0.98 ±0.10
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.40 REF
2.64
±0.10
0.40 p0.10
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
2.56
±0.10
1.70
±0.10
2.76
±0.10
0.74 ±0.10
R = 0.10 TYP
R = 0.10 TYP
R = 0.10
TYP
0.74 ±0.10
0.40 BSC
PACKAGE
OUTLINE
0.20 ±0.05
2.02 ±0.05
2.76 ±0.05
0.98 ±0.05
1.48 ±0.05
0.70 ±0.05
PACKAGE DESCRIPTION
UFF Package
Variation: UFFMA
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev Ø)