Datasheet

LTC3566/LTC3566-2
27
3566fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYPICAL APPLICATIONS
Direct Pin Controlled LTC3566/LTC3566-2 USB Power Manager with 3.3V/1A Buck-Boost
+
Li-Ion
100k
2.2
μF
C2
22
μF
C3
22
μF
105k
L1
3.3μH
L2
2.2
μH
33pF
121k
15k
3.01k0.1μF2k
C1
10
μF
100k
1μF
PARTS LIST
C1: MURATA GRM21BR61A/06KE19
C2,C3: TAIYO-YUDEN JMK212BJ226MG
L1: COILCRAFT LPS4018-332MLC
L2: COILCRAFT LPS4018-222MLC
USB
4.5V TO 5.5V
TO
OTHER
LOADS
3566 TA02
V
BUS
NTC
PROG
CLPROG
LDO3V3
CHRGEN
MODE
SW
V
OUT
GATE
BAT
GND
CHRG
V
IN1
SWAB1
SWCD1
V
OUT1
FB1
V
C1
EN1 GND
LTC3566/
LTC3566-2
ILIM
T
10pF
330pF
324k
3.3V/1A
DISK DRIVE
OPTIONAL
2
TO DIGITAL
CONTROLLER
1k
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
4.00 p 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 p 0.10
(4-SIDES)
0.75 p 0.05
R = 0.115
TYP
0.25 p 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
0.70 p0.05
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.45 p 0.05
(4 SIDES)
3.10 p 0.05
4.50 p 0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 s 45o CHAMFER
PACKAGE DESCRIPTION