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ManualsBrandsLINEAR TECHNOLOGY ManualsPMICsPMIC - DC/DC voltage regulator Holder DFN 8
78910111213141516
LTC3409
12
3409fc
1. The V
IN
quiescent current is due to two components:
the DC bias current as given in the Electrical Charac-
teristics and the internal main switch and synchronous
switch gate charge currents. The gate charge current
results from switching the gate capacitance of the
internal power MOSFET switches. Each time the gate
is switched from high to low to high again, a packet
of charge, dQ, moves from V
IN
to ground. The result-
ing dQ/dt is the current out of V
IN
that is typically
larger than the DC bias current. In continuous mode,
I
GATECHG
= f(Q
T
+ Q
B
) where Q
T
and Q
B
are the gate
charges of the internal top and bottom switches. Both
the DC bias and gate charge losses are proportional to
V
IN
and thus their effects will be more pronounced at
higher supply voltages.
2. I
2
R losses are calculated from the resistances of the
internal switches, R
SW
, and external inductor R
L
. In
continuous mode, the average output current fl owing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET R
DS(ON)
and the duty cycle
(DC) as follows:
R
SW
= (R
DS(ON)TOP
)(DC) + (R
DS(ON)BOT
)(1 – DC)
The R
DS(ON)
for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics.
Thus, to obtain I
2
R losses, simply add R
SW
to R
L
and
multiply the result by the square of the average output
current.
Other losses including C
IN
and C
OUT
ESR dissipative losses
and inductor core losses generally account for less than
2% total additional loss.
Thermal Considerations
In most applications the LTC3409 does not dissipate much
heat due to its high effi ciency. But, in applications where the
LTC3409 is running at high ambient temperature with low
supply voltage and high duty cycles, such as in dropout,
the heat dissipated may exceed the maximum junction
temperature of the part. If the junction temperature reaches
approximately 150°C, both power switches will be turned
off and the SW node will become high impedance.
To avoid the LTC3409 from exceeding the maximum
junction temperature, the user will need to do a thermal
analysis. The goal of the thermal analysis is to determine
whether the operating conditions exceed the maximum
junction temperature of the part. The temperature rise is
given by:
T
R
= (P
D
)(θ
JA
)
where P
D
is the power dissipated by the regulator and θ
JA
is the thermal resistance from the junction of the die to
the ambient temperature.
The junction temperature, T
J
, is given by:
T
J
= T
A
+ T
R
where T
A
is the ambient temperature.
As an example, consider the LTC3409 in dropout at an
input voltage of 1.6V, a load current of 600mA and an
ambient temperature of 75°C. From the typical perfor-
mance graph of switch resistance, the R
DS(ON)
of the
P-channel switch at 75°C is approximately 0.48Ω. There-
fore, power dissipated by the part is:
P
D
= I
LOAD
2
• R
DS(ON)
= 172.8mW
For the DD8 package, the θ
JA
is 43°C/W. Thus, the junction
temperature of the regulator is:
T
J
= 75°C + (0.1728)(43) = 82.4°C
which is well below the maximum junction temperature
of 125°C.
Figure 2
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