Datasheet

LTC3407-2
12
sn34072 34072fs
Figure 3. LTC3407-2 Layout Diagram (See Board Layout Checklist)
RUN2 V
IN
V
IN
V
OUT2
V
OUT1
RUN1
POR
SW1
V
FB1
GND
V
FB2
SW2
MODE/SYNC
LTC3407-2
C
IN
C4C5
L1
L2
R4 R2
R1
R3
C
OUT2
C
OUT1
3407 F03
BOLD LINES INDICATE HIGH CURRENT PATHS
regulator operating in a 70°C ambient temperature is
approximately:
T
J
= 2 • 0.272 • 45 + 70 = 94.5°C
which is below the absolute maximum junction tempera-
ture of 125°C.
Design Example
As a design example, consider using the LTC3407-2 in an
portable application with a Li-Ion battery. The battery
provides a V
IN
= 2.8V to 4.2V. The load requires a maxi-
mum of 800mA in active mode and 2mA in standby mode.
The output voltage is V
OUT
= 2.5V. Since the load still
needs power in standby, Burst Mode operation is selected
for good low load efficiency.
First, calculate the inductor value for about 30% ripple
current at maximum V
IN
:
L
V
MHz mA
V
V
H=
25
2 25 300
1
25
42
15
.
.•
•–
.
.
.
Choosing a vendor’s closest inductor value of 2.2µH,
results in a maximum ripple current of:
=
µ
=I
V
MHz
V
V
mA
L
25
225 22
1
25
42
204
.
.•.
.
.
For cost reasons, a ceramic capacitor will be used. C
OUT
selection is then based on load step droop instead of ESR
requirements. For a 5% output droop:
C
mA
MHz V
F
OUT
25
800
225 5 25
71.
.•(%.)
.
A good standard value is 10µF. Since the output imped-
ance of a Li-Ion battery is very low, C
IN
is typically 10µF.
The output voltage can now be programmed by choosing
the values of R1 and R2. To maintain high efficiency, the
current in these resistors should be kept small. Choosing
2µA with the 0.6V feedback voltage makes R1~300k. A
close standard 1% resistor is 280k, and R2 is then 887k.
The PGOOD pin is a common drain output and requires a
pull-up resistor. A 100k resistor is used for adequate speed.
Figure 1 shows the complete schematic for this design
example.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3407-2. These items are also illustrated graphically in
the layout diagram of Figure 3. Check the following in your
layout:
1. Does the capacitor C
IN
connect to the power V
IN
(Pin 3)
and GND (exposed pad) as close as possible? This capaci-
tor provides the AC current to the internal power MOSFETs
and their drivers.
2. Are the C
OUT
and L1 closely connected? The (–) plate of
C
OUT
returns current to GND and the (–) plate of C
IN
.
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of C
OUT
and a ground sense line
terminated near GND (exposed pad). The feedback signals
V
FB
should be routed away from noisy components and
traces, such as the SW line (Pins 4 and 7), and its trace
should be minimized.
4. Keep sensitive components away from the SW pins. The
input capacitor C
IN
and the resistors R1 to R4 should be
routed away from the SW traces and the inductors.
5. A ground plane is preferred, but if not available, keep the
signal and power grounds segregated with small signal
components returning to the GND pin at one point and
should not share the high current path of C
IN
or C
OUT
.
6. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise of
power components. These copper areas should be con-
nected to V
IN
or GND.
APPLICATIO S I FOR ATIO
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