Datasheet

LTC2995
19
2995f
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However, no responsibilit y is assumed for its use. Linear Technology Corporation makes no representa-
t i o n t h a t t h e i n t e r c o n n e c t i o n o f i t s c i r c u i t s a s d e s c r i b e d h e r e i n w i l l n o t i n f r i n g e o n e x i s t i n g p a t e n t r i g h t s .
PACKAGE DESCRIPTION
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
R = 0.05
TYP
0.20 ± 0.05
1
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 × 45°
CHAMFER
19 20
2
0.40 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
(4 SIDES)
0.70 ±0.05
0.00 – 0.05
(UD20) QFN 0306 REV A
0.20 ±0.05
0.40 BSC
PACKAGE
OUTLINE
UD Package
20-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1720 Rev A)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.