Datasheet

LTC2974
95
2974fc
For more information www.linear.com/LTC2974
Figure 42. Suggested Screen Pattern for Die Attach Pad
Figure 41. Connecting Unused Inputs to GND
2974 F42
QFN PACKAGE
APERATURE DESIGN 50% TO 80% REDUCTION GROUND PLANE
prevent loading of the filter. The temperature sense inputs
(T
SENSEn
) may be left floating. The temperture reported on
floating T
SENSE n
inputs will be the internal die temperature
(READ_TEMPERATURE_2).
PCB Board Layout
Mechanical stress on a PC board and soldering-induced
stress can cause the LTC2974’s reference voltage and the
voltage drift to shift. A simple way to reduce the stress-
related shifts is to mount the IC near the short edge of
the PC board, or in a corner. The board acts as a stress
boundary, or a region where the flexure of the board is
minimal.
applicaTions inForMaTion
100k
100k
V
SENSEP
V
SENSEM
LTC2974
2974 F41