Datasheet

LTC2970/LTC2970-1
35
29701fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
12.7k
10Ω
0.1μF
22μF
0.1μF
I
2
C BUS
100Ω
29701 F07
LTC2970
ALERT
SCL
SDA
REF
12V
IN
GND ASEL0 ASEL1
V
DD
I
OUT0
V
IN1_AP
V
IN0_AP
V
OUT1
I
OUT1
V
OUT0
V
OUT
+
–
V
IN0_AM
V
IN1_AM
8V TO 15V
0.1μF
Figure 7. Programmable Reference Application Circuit
UFD Package
24-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1696)
PACKAGE DESCRIPTIO
U
4.00 ± 0.10
(2 SIDES)
2.65 ± 0.10
(2 SIDES)
5.00 ± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.05
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
3.65 ± 0.10
(2 SIDES)
0.75 ± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.30 TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD24) QFN 0505
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.65 ± 0.05
(2 SIDES)
3.65 ± 0.05
(2 SIDES)
4.10 ± 0.05
5.50 ± 0.05
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
TYPICAL APPLICATIO
U