Datasheet

ManualsBrandsLINEAR TECHNOLOGY ManualsData collecting ICsData acquisition IC - DA converter (DAC) SSOP 28

LTC2756

2756f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

package DescripTion

G Package

28-Lead Plastic SSOP (5.3mm)

(Reference LTC DWG # 05-08-1640)

G28 SSOP 0204

0.09 – 0.25

(.0035 – .010)

0° – 8°

0.55 – 0.95

(.022 – .037)

5.00 – 5.60**

(.197 – .221)

7.40 – 8.20

(.291 – .323)

1 2 3 4

8 9 10 11 12 1413

9.90 – 10.50*

(.390 – .413)

2526 22 21 20 19 18

16 1523242728

2.0

(.079)

MAX

0.05

(.002)

MIN

0.65

(.0256)

BSC

0.22 – 0.38

(.009 – .015)

TYP

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

0.42 ±0.03 0.65 BSC

5.3 – 5.7

7.8 – 8.2

RECOMMENDED SOLDER PAD LAYOUT

1.25 ±0.12

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.