Datasheet
27
LTC1968
1968f
U
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
TYPICAL APPLICATIO S
U
±2.5V Supplies, Single Ended, DC-Coupled
RMS-to-DC Converter with Shutdown
RMS Noise Measurement
V
+
2.5V
–2.5V
–2.5V
LTC1968
IN1 DC OUTPUT
C
AVE
10µF
0.1µF
X7R
IN2
1968 TA04
V
OUT
DC + AC
INPUT
(1V
PEAK
)
OUT RTN
GND
EN
OFF
≥2V
≤–2V
ON
V
+
2.5V
–2.5V
2.5V
–2.5V
LTC1968
IN1
C
AVE
10µF
0.1µF
1.5µF
IN2
1968 TA05
V
OUT
VOLTAGE
NOISE IN
OUT RTN
GND EN
1mV
DC
1µV
RMS
OF INPUT NOISE
V
OUT
=
–
+
1k
100Ω
100Ω
100k
BW ≈ 1kHz TO 100kHz
INPUT SENSITIVITY = 1µV
RMS
TYP
1/2
LTC6203
MSOP (MS8) 0204
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC