Datasheet

LTC1871-1
22
18711fb
APPLICATIONS INFORMATION
Figure 14. LTC1871-1 Boost Converter Suggested Layout
Figure 15. LTC1871-1 Boost Converter Layout Diagram
LTC1871-1
M1
V
IN
18711 F14
V
OUT
SWITCH NODE IS ALSO
THE HEAT SPREADER
FOR L1, M1, D1
L1
R
T
R
C
C
C
R3
J1
C
IN
C
OUT
C
VCC
R1
R2
PSEUDO-KELVIN
SIGNAL GROUND
CONNECTION
TRUE REMOTE
OUTPUT SENSING
VIAS TO GROUND
PLANE
R4
PIN 1
C
OUT
BULK C LOW ESR CERAMIC
JUMPER
D1
RUN
I
TH
FB
FREQ
MODE/
SYNC
SENSE
V
IN
INTV
CC
GATE
GND
LTC1871-1
+
R4
J1
10
9
8
7
6
1
2
3
4
5
C
VCC
PSEUDO-KELVIN
GROUND CONNECTION
C
IN
M1
D1
L1
V
IN
GND
18711 F15
V
OUT
SWITCH
NODE
C
OUT
R
C
R1
R
T
BOLD LINES INDICATE HIGH CURRENT PATHS
R2
C
C
R3
+
PC Board Layout Checklist
1. In order to minimize switching noise and improve output
load regulation, the GND pin of the LTC1871-1 should
be connected directly to 1) the negative terminal of the
INTV
CC
decoupling capacitor, 2) the negative terminal
of the output decoupling capacitors, 3) the
source of
the power MOSFET or the bottom terminal of the sense
resistor, 4) the negative terminal of the input capacitor
and 5) at least one via to the ground plane immediately
adjacent to Pin 6. The ground trace on the top layer of
the PC board should be as wide and short as possible
to minimize series resistance and inductance.