Datasheet

14
LTC1864L/LTC1865L
sn18645L 18645Lfs
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0802
0.53 ± 0.015
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.13 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.15
(1.93 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
U
PACKAGE DESCRIPTIO