Datasheet

LTC1773
19
1773fb
PACKAGE DESCRIPTIO
U
TYPICAL APPLICATIONS
U
1773 TA09
1
2
3
4
5
10
9
8
7
6
R
SENSE
0.04Ω
33pF
200pF
0.1µF
30k
100k
1%
80.6k
1%
V
OUT
1.8V
2A
4.5V ≤ V
IN
≤ 5.5V
LTC1773
RUN/SS
SYNC/FCB
GND
SENSE
–
V
IN
TG
I
TH
V
FB
V
IN
BG
SW
L1
2.5µH
C
IN
47µF
10V
Si9942DY
C
OUT
47µF
10V
C
IN
, C
OUT
: TAIYO YUDEN LMK550BJ476MM
L1: CDRH5D28
R
SENSE
: IRC LR1206-01-R040-F
Figure 15. 5V to 1.8V/2A Regulator with Ceramic Capacitors
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.53
± 0.152
(.021 ± .006)
0.18
(.007)
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
MSOP (MS) 0603
SEATING
PLANE
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX