Datasheet

11
LTC1772
1772fb
LTC1772 High Efficiency, Small Footprint 3.3V to 1.8V/0.5A Regulator
I
TH
/RUN
LTC1772
R4
10k
R1
0.15Ω
R2
100k
R3
80.6k
L1
10µH
M1
D1
C3
220pF
GND
V
FB
6
5
4
1772 TA02
1
2
3
PGATE
V
IN
SENSE
–
C1
10µF
10V
V
IN
3.3V
V
OUT
1.8V
0.5A
C2
47µF
6V
+
C1: TAIYO YUDEN CERAMIC
LMK325BJ106K-T
C2: SANYO POSCAP 6TPA47M
D1: MOTOROLA MBRM120T3
L1: COILTRONICS UP1B-100
M1: Si3443DV
R1: DALE 0.25W
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
U
TYPICAL APPLICATIO
U
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF