Datasheet

3
LTC1540
sn1540 1540fas
The denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
+
= 5V, V
= GND = 0V, T
A
= 25°C unless otherwise noted.
ELECTRICAL CHARACTERISTICS
V
+
= 3V, V
= GND = 0V, T
A
= 25°C unless otherwise noted.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
HYST
Hysteresis Input Voltage Range REF – 50mV REF V
t
PD
Propagation Delay C
OUT
= 100pF Overdrive = 10mV 60 µs
Overdrive = 100mV 50 µs
V
OH
Output High Voltage I
O
= –13mA V
+
– 0.4V V
V
OL
Output Low Voltage I
O
= 1.8mA GND + 0.4V V
Reference
V
REF
Reference Voltage No Load (SO-8)/(DFN) Commercial 1.158 1.182 1.206 V
MS8 Commercial
1.156 1.182 1.208 V
(SO-8)/(MS8)/(DFN) Industrial
1.152 1.182 1.212 V
V
REF
Load Regulation 0 I
SOURCE
100µA 0.5 2.5 mV
0 I
SINK
10µA 0.5 1.5 mV
5mV
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Power Supply
V
+
Supply Voltage Range 211V
I
CC
Supply Current IN
+
= IN
= 80mV, HYST = REF, C-Grade 0.28 0.61 µA
IN
+
= IN
= 80mV, HYST = REF, I-Grade 0.64 µA
Comparator
V
OS
Comparator Input Offset Voltage V
CM
= 2.5V ±12 mV
±15 mV
LTC1540CMS8/IMS8
±16 mV
I
IN
Input Leakage Current (IN
+
, IN
)V
IN
+
= V
IN
= 1.5V ±0.01 ±1nA
Input Leakage Current (HYST)
±0.02 ±1nA
V
CM
Comparator Input Common Mode Range V
V
+
– 1.3V V
CMRR Common Mode Rejection Ratio V
to V
+
– 1.3V 0.1 1 mV/V
PSRR Power Supply Rejection Ratio V
+
= 2V to 11V 0.1 1 mV/V
V
HYST
Hysteresis Input Voltage Range REF – 50mV REF V
t
PD
Propagation Delay C
OUT
= 100pF Overdrive = 10mV 70 µs
Overdrive = 100mV 60 µs
V
OH
Output High Voltage I
O
= –8mA V
+
– 0.4V V
V
OL
Output Low Voltage I
O
= 0.8mA GND + 0.4V V
Reference
V
REF
Reference Voltage No Load (SO-8)/(DFN) Commercial 1.158 1.182 1.206 V
MS8 Commercial
1.156 1.182 1.208 V
(SO-8)/(MS8)/(DFN) Industrial
1.152 1.182 1.212 V
V
REF
Load Regulation 0 I
SOURCE
100µA 0.75 3.5 mV
0 I
SINK
10µA 0.5 1.5 mV
5mV
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The θ
JA
specified for the DD package is with minimal PCB heat
spreading metal. Using expanded metal area on all layers of a board
reduces this value.