Datasheet

30
LTC1290
1290fe
J Package
20-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
OBSOLETE PACKAGE
J20 1298
3
7
56
109
1
42
8
11
20 16 1517 14 13 1219 18
0.005
(0.127)
MIN
0.025
(0.635)
RAD TYP
0.220 – 0.310
(5.588 – 7.874)
1.060
(26.924)
MAX
0° – 15°
0.008 – 0.018
(0.203 – 0.457)
0.015 – 0.060
(0.381 – 1.524)
0.125
(3.175)
MIN
0.014 – 0.026
(0.356 – 0.660)
0.045 – 0.065
(1.143 – 1.651)
0.100
(2.54)
BSC
0.200
(5.080)
MAX
0.300 BSC
(0.762 BSC)
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
CORNER LEADS
OPTION
(4 PLCS)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER
DIP/PLATE OR TIN PLATE LEADS
N Package
20-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
PACKAGE DESCRIPTIO
U
N20 0405
.020
(0.508)
MIN
.120
(3.048)
MIN
.125 – .145
(3.175 – 3.683)
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.018 ± .003
(0.457 ± 0.076)
.005
(0.127)
MIN
.255 ± .015*
(6.477 ± 0.381)
1.060*
(26.924)
MAX
12
3
4
5
6
7
8
910
19 1112
131416
1517
18
20
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255
()
NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC