Datasheet

LT8611
23
8611f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
Typical applicaTions
3.00 ± 0.10
1.50 REF
5.00 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 ± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UDD24) QFN 0808 REV Ø
R = 0.05 TYP
1.65 ± 0.10
3.65 ± 0.10
UDD Package
24-Lead Plastic QFN (3mm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
1.50 REF
2.10 ± 0.05
3.50 ± 0.05
PACKAGE
OUTLINE
1.65 ± 0.05
3.65 ± 0.05
0.50 BSC
2A LED Driver
BSTV
IN
EN/UV
SYNC
IMON
ICTRL
INTV
CC
TR/SS
RT
SW
LT8611
GND
ISP
ISN
BIAS
PG
8611 TA11
FB
0.1µF
2A
4.7µF
V
IN
3.8V TO 42V
1µF
0.1µF
4.7µH
0.025Ω
60.4k
f = 700kHz
D1: LUMINUS CBT-40
PGND
4.7µF
ON OFF
1µF
D1
420k
10pF
100k