Datasheet

LT6703-2/LT6703-3
LT6703HV-2/LT6703HV-3
12
670323fd
DC Package
3-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1717 Rev A)
2.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (W-TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
BOTTOM VIEW—EXPOSED PAD
1.00 p 0.05
(2 SIDES)
1.35 p 0.05
(2 SIDES)
0.75 p0.05
0.40 p0.10
0.70 p0.05
1
3
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC3) DFN 0309 REV A
0.25 p 0.05
R = 0.05
TYP
R = 0.125 TYP
0.50 BSC
0.25 p 0.05
1.35 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.00 p0.05
(2 SIDES)
1.30 p0.05
2.00 p0.05
PACKAGE
OUTLINE
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25 s 45o
CHAMFER
PACKAGE DESCRIPTION