Datasheet

LT6654
20
6654fd
For more information www.linear.com/LT6654
package DescripTion
7
8
1
3
4
2
2.00 REF
R0.20 REF
6
5
7
8
6
5
1
2
3
4
4.20 ±0.10
4.20 SQ ±0.10
2.54 ±0.15
1.00 ×
7 TYP
0.64 × 8 TYP
LS8 0113 REV B
R0.20 REF
0.95 ±0.10
1.45 ±0.10
0.10 TYP0.70 TYP
1
4
7
8
6
1.4
0.5
1.50 ±0.15
2.50 ±0.15
2.54 ±0.15
0.70 ±0.05 × 8
PACKAGE OUTLINE
0.5
5.00 SQ ±0.15
5.00 SQ ±0.15
5.00 SQ ±0.15
5.80 SQ ±0.15
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS PACKAGE DO NOT INCLUDE PLATING BURRS
PLATING BURRS, IF PRESENT, SHALL NOT EXCEED 0.30mm ON ANY SIDE
4. PLATING—ELECTO NICKEL MIN 1.25UM, ELECTRO GOLD MIN 0.30UM
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(SEE NOTE 5)
2
3
LS8 Package
8-Pin Leadless Chip Carrier (5mm × 5mm)
(Reference LTC DWG # 05-08-1852 Rev B)
ABCDEF
XYY ZZ
e4
Q12345
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
1.4
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.