Datasheet

LT6003/LT6004/LT6005
18
600345fd
3.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.20
TYP
4.40 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHC16) DFN 1103
0.25 ± 0.05
PIN 1
NOTCH
0.50 BSC
4.40 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.20 ±0.05
0.50 BSC
0.65 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
PACKAGE DESCRIPTION
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1706)
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8°
TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165 ± .0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE