Datasheet

LT6003/LT6004/LT6005
16
600345fd
PACKAGE DESCRIPTION
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
DC Package
4-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1724 Rev B)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302 REV B
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1
LOCATION ON THE TOP AND BOTTOM OF PACKAGE
BOTTOM VIEW—EXPOSED PAD
1.35 REF
0.75 ±0.05
0.40 ±0.10
0.70 ±0.05
1
4
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC4) DFN 0309 REV B
0.23 ± 0.05
R = 0.05
TYP
0.45 BSC
0.25 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDEDED
1.30 ±0.05
2.00 ±0.05
PACKAGE
OUTLINE
0.45 BSC
1.35 REF
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
R = 0.115
TYP
1.35 ± 0.10
1.00 ± 0.10
1.35 ±0.05
1.00 ±0.05