Datasheet

LT3959
18
3959fa
For more information www.linear.com/LT3959
applicaTions inForMaTion
Check the stress on the internal power MOSFET by mea-
suring the SW-to-GND voltage directly across the IC ter-
minals.
Make
sure the inductive ringing does not exceed
the maximum rating of the internal power MOSFET (40V).
The small-signal components should be placed away from
high frequency switching nodes. For optimum load regula
-
tion and true remote sensing, the top of the output voltage
sensing
resistor divider should connect independently to
the top of the output capacitor (Kelvin connection), staying
away from any high dV/dt traces. Place the divider resis-
tors near
the LT3959 in order to keep the high impedance
FBX node short.
Figure
5 shows the suggested layout of the 2.5V to 8V
input, 12V output boost converter in the Typical Applica
-
tion section.