Datasheet

LT3845
24
3845fd
PACKAGE DESCRIPTION
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation BC
FE16 (BC) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0o – 8o
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.94
(.116)
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
0.45 p0.05
0.65 BSC
4.50 p0.10
6.60 p0.10
1.05 p0.10
2.94
(.116)
3.58
(.141)
3.58
(.141)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
N Package
16-Lead PDIP
(Reference LTC DWG # 05-08-1510)
N16 1002
.255 p .015*
(6.477 p 0.381)
.770*
(19.558)
MAX
16
1
2
3
4
5
6
7
8
910
11
12
13
14
15
.020
(0.508)
MIN
.120
(3.048)
MIN
.130 p .005
(3.302 p 0.127)
.065
(1.651)
TYP
.045 – .065
(1.143 – 1.651)
.018 p .003
(0.457 p 0.076)
.008 – .015
(0.203 – 0.381)
.300 – .325
(7.620 – 8.255)
.325
+.035
–.015
+0.889
–0.381
8.255

NOTE:
1. DIMENSIONS ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.100
(2.54)
BSC