Datasheet

LT3845
20
3845fd
Locate the feedback resistors in close proximity to the
LT3845 to minimize the length of the high impedance
V
FB
node.
The SENSE
–
and SENSE
+
traces should be routed together
and kept as short as possible.
APPLICATIONS INFORMATION
The LT3845 TSSOP package has been designed to ef-
fi ciently remove heat from the IC via the Exposed Pad on
the backside of the package. The Exposed Pad is soldered
to a copper footprint on the PCB. This footprint should be
made as large as possible to reduce the thermal resistance
of the IC case to ambient air.
Orientation of Components Isolates Power Path and PGND Currents,
Preventing Corruption of SGND Reference
BOOST
V
CC
SW
PGNDSGND
LT3845
SGND
REFERRED
COMPONENTS
+
+
BG
TG
V
OUT
3845 AI03
V
IN
I
SENSE
SW