Datasheet

LT3690
28
3690fa
package DescripTion
UFE Package
26-Lead Plastic QFN (4mm × 6mm)
(Reference LTC DWG # 05-08-1770 Rev A)
4.00 ± 0.10
2.50 REF
6.00 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
26
25
2
BOTTOM VIEW—EXPOSED PAD
4.50 REF
0.75 ± 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.35 × 45°
CHAMFER
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFE26MA) QFN 0608 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
2.50 REF
4.50 REF
2.64 ± 0.05 2.64 ± 0.05
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
2.36 ± 0.10 2.31 ± 0.10
2.18 ± 0.10
2.55 ± 0.05
3.25 ± 0.05
UFEMA Package
26-Lead Plastic QFN (4mm × 6mm)
(Reference LTC DWG # 05-08-1770 Rev A)
2.64 ± 0.10
0.41 ± 0.10
0.25 ±0.05
0.50 BSC
2.18 ± 0.05
0.41 ± 0.05
2.31 ± 0.05
2.36 ± 0.05
2.64 ± 0.10
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.