Datasheet

LT3596
20
3596fa
package DescripTion
UHG Package
Variation: UHG52 (39)
52-Lead Plastic QFN (5mm × 8mm)
(Reference LTC DWG # 05-08-1846 Rev B)
5.00 p 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
5150484644
43
41
39
37
35
34
33
32
31
30
29
28
27
43
48
46 4451 50
41
39
37
35
34
33
32
31
30
29
28
27
2
4
6
7
9
11
12
13
14
15
16
17
2
4
6
7
9
11
12
13
14
15
16
17
181920212223242526
BOTTOM VIEW—EXPOSED PAD
5.90 p0.10
6.40 REF
8.00 p 0.10
0.75 p 0.05
0.75 p 0.05
R = 0.10
TYP
R = 0.10
TYP
0.20 p 0.05
(UHG39) QFN 0410 REV B
0.40 BSC
0.80 BSC
0.70 TYP
0.60 TYP
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.20 REF
0.40 p0.10
0.00 – 0.05
18 19 20 21 22 23 24 25 26
0.70 p 0.05
41 39 37 35 34 33 32 31 30 29 28 27
26
25
24
23
22
21
20
19
18
1716151413121197642
43
44
46
48
50
51
0.40 BSC0.80 BSC
6.40 REF
3.20 REF
4.10 p 0.05
5.50 p 0.05
0.20 p 0.05
5.90 p0.05
2.90 p0.05
7.10 p 0.05
8.50 p 0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 s 45o CHAMFER
2.90 p0.10