Manualshelf

Datasheet

ManualsBrandsLINEAR TECHNOLOGY ManualsPMICsPMIC - DC/DC voltage regulator Boost, Cuk, SEPIC MSOP 8 EP
11121314151617181920
LT3580
17
3580fg
Figure 9. Suggested Component Placement for Boost Topology
(Both DFN and MSOP Packages. Not to Scale). Pin 9 (Exposed
Pad) Must Be Soldered Directly to the Local Ground Plane for
Adequate Thermal Performance. Multiple Vias to Additional
Ground Planes Will Improve Thermal Performance
Figure 10. Suggested Component Placement for Sepic Topology
(Both DFN And MSOP Packages. Not to Scale). Pin 9 (Exposed
Pad) Must Be Soldered Directly to the Local Ground Plane for
Adequate Thermal Performance. Multiple Vias to Additional
Ground Planes Will Improve Thermal Performance
Figure 11. Suggested Component Placement for Inverting Topology (Both DFN and MSOP Packages. Not to Scale).
Note Cut in Ground Copper at Diode’s Cathode. Pin 9 (Exposed Pad) Must be Soldered Directly to Local Ground
Plane for Adequate Thermal Performance. Multiple Vias to Additional Ground Planes Will Improve Thermal
Performance
APPLICATIONS INFORMATION
3580 F10
V
OUT
V
IN
5
6
7
8
9
4
3
2
1
SW
L1
L2
D1
C3
C2
C1
SHDN
SYNC
GND
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
3580 F11
V
OUT
V
IN
5
6
7
8
9
4
3
2
1
SW
C1
C2
D1
C3
L1
L2
SHDN
SYNC
GND
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
3580 F09
V
OUT
V
IN
C2
L1
C1
D1
5
6
7
8
9
4
3
2
1
SW
SHDN
SYNC
GND
VIAS TO GROUND
PLANE REQUIRED
TO IMPROVE
THERMAL
PERFORMANCE
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.