Datasheet

LT3511
24
3511fc
PACKAGE DESCRIPTION
MS Package
Variation: MS16 (12)
16-Lead Plastic MSOP with 4 Pins Removed
(Reference LTC DWG # 05-08-1847 Rev A)
MSOP (MS12) 0510 REV A
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
1.0
(.0394)
BSC
0.50
(.0197)
BSC
16 14 121110
135678
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
1.0
(.0394)
BSC
4.039 p 0.102
(.159 p .004)
(NOTE 3)
0.1016 p 0.0508
(.004 p .002)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.280 p 0.076
(.011 p .003)
REF
4.90 p 0.152
(.193 p .006)
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.