Datasheet

LT3505
23
3505fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE
OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
3.00 ±0.10
(4 SIDES)
0.75 ±0.05
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
(DD) DFN 1203
0.25 ± 0.05
0.50 BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.53
± 0.152
(.021 ± .006)
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
0.18
(.007)
DETAIL “A”
MSOP (MS8E) 0603
SEATING
PLANE
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127
± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
1 2
3
4
4.90 ± 0.152
(.193 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83 ± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083
± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
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