Datasheet

LT3483/LT3483A
9
3483fc
TYPICAL APPLICATIONS
3.6V to –8V DC/DC Converter
Low Profile, Small Footprint
Switching Waveform
SW
L1
10µH
D
LT3483
FB
C1
4.7µF
C2
0.22µF
D1
V
IN
10Ω
R1
806k
C1: MURATA GRM219R61A475KE34B
C2: TAIYO YUDEN LMK107BJ224
C3: MURATA GRM219R61C225KA88B
D1: PHILIPS PMEG2005EB
L1: MURATA LQH2MCN100K02L
5pF
C3
2.2µF
3483 TA04a
V
OUT
–8V
25mA
V
IN
3.6V
SHDN
GND
3483 TA04b
I
SW
100mA/DIV
V
OUT
20mV/DIV
2µs/DIV
PACKAGE DESCRIPTION
DC Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev A)
2.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.64 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.37 ±0.10
(2 SIDES)
1
4
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC8) DFN 0409 REVA
0.23 ± 0.05
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
0.25 ± 0.05
1.37 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.45 BSC